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Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

机译：使用有关集成电路（IC）经历过的制造程序（例如修理）的数据来选择IC将会经历的过程（例如其他修理）的方法

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摘要

An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on IC's at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the IC's. The ID codes of the IC's are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the IC's is then accessed, and additional repair procedures the IC's may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.

机译：集成电路（IC）制造过程中的发明方法，该方法使用关于在探针处对IC进行的修理程序的数据来确定在制造过程中以后是否将进行进一步的修理，包括与每个保险丝ID相关联地存储数据。 IC的。例如，在制造过程中的开路/短路测试中，会自动读取IC的ID码。然后访问与IC的ID码关联存储的数据，并根据访问的数据选择IC可能经历的其他维修程序。因此，例如，所访问的数据可以指示IC是不可修复的，因此如传统IC制造工艺中所必需的那样，IC可以直接进入废料仓而无需查询以确定其是否可维修。

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公开/公告号US6553276B2

专利类型
公开/公告日2003-04-22

原文格式PDF
申请/专利权人 MICRON TECHNOLOGY INC.;
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申请/专利号US20020071961
发明设计人 SALMAN AKRAM;DAVID R. HEMBREE;ALAN G. WOOD;JOHN O JACOBSON;MICHAEL E. HESS;JAMES M. WARK;DEREK J. GOCHNOUR;WARREN M. FARNWORTH;
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申请日2002-02-05
分类号G06F190/00;
国家 US
入库时间 2022-08-22 00:05:44

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