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Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power module

机译:射频功率部件,射频功率模块,制造射频功率部件的方法和制造射频功率模块的方法

摘要

A radio-frequency power component and a radio-frequency power module, as well as to methods for producing them are encompassed. The radio-frequency power component has a semiconductor chip that is suitable for flip chip mounting. The semiconductor chip has an active upper face that produces power losses. This active upper face is covered by an electrically isolating layer leaving free contact surfaces, with a heat-dissipating metal layer being applied to its upper face. The metal layer directly dissipates the heat losses from the active semiconductor structures.
机译:涵盖了射频功率组件和射频功率模块,以及其制造方法。射频功率组件具有一个适用于倒装芯片安装的半导体芯片。半导体芯片的有源上表面会产生功率损耗。该有源上表面由留有自由接触表面的电绝缘层覆盖,并在其上表面施加了散热金属层。金属层直接消散来自有源半导体结构的热损失。

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