首页> 外国专利> ATMOSPHERIC PRESSURE PLASMA TREATING DEVICE, ATMOSPHERIC PRESSURE PLASMA TREATING METHOD AND ELECTRODE SYSTEM FOR ATMOSPHERIC PRESSURE PLASMA TREATING DEVICE

ATMOSPHERIC PRESSURE PLASMA TREATING DEVICE, ATMOSPHERIC PRESSURE PLASMA TREATING METHOD AND ELECTRODE SYSTEM FOR ATMOSPHERIC PRESSURE PLASMA TREATING DEVICE

机译:大气等离子处理装置,大气等离子处理方法及电极系统

摘要

PROBLEM TO BE SOLVED: To provide an atmospheric pressure plasma treating device and an atmospheric pressure plasma treating method which enable surface treatment of various shapes of base materials to be executed, are excellent in surface treating capacity to the base material and are excellent in productivity at a low cost. ;SOLUTION: The atmospheric pressure plasma treating device has a means for generating an excited inactive gas by exciting an inactive gas and a means for changing a reactive gas to plasma by bringing the excited inactive gas into contact with the reactive gas and surface treatment of the base material is executed by bringing the plasma of the reactive gas into contact with the surface of the base material. The atmospheric pressure plasma treating device is characterized by bringing the excited inactive gas into contact with the reactive gas so as to hold the reactive gas therebetween or wrap the reactive gas therein.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种大气压等离子体处理装置和大气压等离子体处理方法,所述大气压等离子体处理装置和大气压等离子体处理方法能够进行各种形状的基材的表面处理,对基材的表面处理能力优异,并且生产率优异。成本低。 ;解决方案:大气压等离子体处理装置具有通过激发惰性气体而产生激发惰性气体的装置,以及通过使激发的惰性气体与反应气体接触并对其表面进行处理而将反应气体变为等离子体的装置。通过使反应性气体的等离子体与基材表面接触来执行基材。大气压等离子体处理装置的特征在于使被激发的惰性气体与反应气体接触,从而将反应气体保持在它们之间或将反应气体包裹在其中。COPYRIGHT:(C)2003,JPO

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