首页> 外国专利> High temperature component used as heating element in gas sensor comprises non-conducting intermediate layer between conducting pathway and silicon dioxide conducting pathway protection layer

High temperature component used as heating element in gas sensor comprises non-conducting intermediate layer between conducting pathway and silicon dioxide conducting pathway protection layer

机译:在气体传感器中用作加热元件的高温组件包括位于导电通道和二氧化硅导电通道保护层之间的非导电中间层

摘要

A high temperature component comprises a non-conducting intermediate layer between a conducting pathway (2) and a silicon dioxide conducting pathway protection layer (4b). The intermediate layer is thicker than the protection layer. Preferred Features: The conducting pathway is made from platinum and is formed as a hot conductor pathway in a meander-like manner on the ceramic substrate (3). The silicon dioxide layer has a thickness of 0.1-1.5 microns m and the intermediate layer has a thickness of 1-5 microns m. The intermediate layer is made from aluminum oxide.
机译:高温组分包括在导电路径(2)和二氧化硅导电路径保护层(4b)之间的不导电中间层。中间层比保护层厚。优选的特征:导电路径由铂制成并且在陶瓷基板(3)上以曲折状方式形成为热导体路径。二氧化硅层的厚度为0.1-1.5微米,中间层的厚度为1-5微米。中间层由氧化铝制成。

著录项

  • 公开/公告号DE10049572A1

    专利类型

  • 公开/公告日2002-05-02

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE2000149572

  • 发明设计人

    申请日2000-10-06

  • 分类号H01L49/02;H05B3/12;H01L23/28;G01N27/403;

  • 国家 DE

  • 入库时间 2022-08-22 00:27:28

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