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Wiring board for bump bonding semiconductor device assembled from the wiring board and manufacturing method of wiring board for bump bonding
Wiring board for bump bonding semiconductor device assembled from the wiring board and manufacturing method of wiring board for bump bonding
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机译：由该配线基板组装而成的凸点接合用半导体装置用配线基板及凸点接合用配线基板的制造方法
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摘要
The present invention was preventing the occurrence of disconnection between the bump and the wiring and less variation in the bump height, and a method of manufacturing a semiconductor device and a junction circuit board for the bump assembled using this excellent bump-bonding circuit board, the circuit board for production to provide.; To one hour of using a dielectric layer having a conductive layer on the surface to prepare a bump bonding circuit boards, first, on one surface of the conductive layer is provided with a first resist layer, and exposed and developed, and the area other than the bump formation area the first resist layer is removed, which, by half etching a conductive layer bumps are formed then, and remove the first resist layer as needed, there is provided a second resist layer, and exposed and developed, and the exposed conductive layer the wiring pattern is formed by etching. Then, after removing the resist above if desired wiring pattern, a protective resist layer is provided on the entire surface of the wiring pattern side, and is exposed and developed, then the exposed surface of the bumps, and then, the protective resist layer is cured. Then, by etching from the surface side of the insulating layer in a desired region a hole formed blank, the surface of the via hole to the exposed lower surface and the bump are made of zinc-coated metal.
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