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Diamond thin film formation method by laser ablation combined with high voltage discharge plasma CVD and diamond bulk fabrication method under the conditions of high temperature and high pressure
Diamond thin film formation method by laser ablation combined with high voltage discharge plasma CVD and diamond bulk fabrication method under the conditions of high temperature and high pressure
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机译：高温高压条件下激光烧蚀结合高压放电等离子体CVD形成金刚石薄膜的方法及金刚石块的制造方法
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摘要
The present invention condenses the laser beam 2 generated from the laser source 1, which is a laser generation source, with a lens 3, thereby eliminating the need for a separate rotary motor 5 located in the vacuum chamber 4, thereby fixing the high purity graphite target 6 unnecessary. ), The ablation phenomenon (laser plume 7) generated on the surface thereof upon irradiation and the discharge plasma 9 generated between the graphite cathode 6 and the graphite anode 8 are mixed together. When the diamond is formed on the substrate 11 on the graphite anode 8 without heating the substrate 11 by a separate substrate heater 10 due to the high temperature at the center of the generated plasma 9, the plasma zone ), And a large amount of atomic hydrogen is supplied to the guide tube 13 into the reactor 12 located inside the vacuum chamber 4 from the outside. Efficiently on Function to form a high quality seed diamond thin film, which is sandwiched in a specially designed high temperature high pressure furnace and sandwiched with a high purity graphite plate or DLC (Diamond like carbon) powder between the thin films. When high temperature is reached, high pressure is applied to form diamond bulk, and hydrogen gas is charged up to a constant pressure in the lamination wrapped with tantalum (Ta) or Mo so that atomic hydrogen can function as in thin film formation. The present invention relates to a diamond thin film production by a laser ablation method and a high voltage discharge plasma CVD method (lasma mixing method), and a method of forming diamond bulk under high temperature and high pressure conditions.
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