首页> 外国专利> HALOGEN-FREE FLAME-RETARDANT EPOXY RESIN COMPOISITION, HALOGEN-FREE FLAME-RETARDANT EPOXY RESIN COMPOSITION FOR BUILD-UP TYPE MULTILAYER BOARDS, PREPREGS, COPPER-CLAD LAMINATES, PRINTED WIRING BOARDS, RESIN FILMS WITH COPPER FOIL OR CARRIERS, AND BUILD-UP TYPE LAMINATES AND MULTILAYER BOARDS

HALOGEN-FREE FLAME-RETARDANT EPOXY RESIN COMPOISITION, HALOGEN-FREE FLAME-RETARDANT EPOXY RESIN COMPOSITION FOR BUILD-UP TYPE MULTILAYER BOARDS, PREPREGS, COPPER-CLAD LAMINATES, PRINTED WIRING BOARDS, RESIN FILMS WITH COPPER FOIL OR CARRIERS, AND BUILD-UP TYPE LAMINATES AND MULTILAYER BOARDS

机译：无卤阻燃树脂环氧树脂组合物，无卤阻燃环氧树脂组合物，用于多层板，预浸料，覆铜箔层压板，印刷线路板，树脂薄膜或带衬里的铜箔层压板类型层压板和多层板

页面导航

摘要
著录项
相似文献

摘要

A halogen-free flame-retardant epoxy resin composition which comprises as the essential components (A) at least one crosslinked phenoxyphosphazene compound, (B) at least one polyepoxide compound such as bisphenol A type epoxy resin, (C) a curing agent for epoxy resins, e.g., bisphenol A type novolak resin, and (D) a curing accelerator for epoxy resins, and contains 0 to 50 wt.% of an inorganic filler.

机译：一种无卤阻燃环氧树脂组合物，其包含（A）至少一种交联的苯氧基磷腈化合物，（B）至少一种多环氧化合物例如双酚A型环氧树脂，（C）作为环氧树脂的固化剂作为基本组分。树脂，例如双酚A型酚醛清漆树脂，和（D）用于环氧树脂的固化促进剂，并且包含0至50重量％的无机填料。

著录项

公开/公告号WO0206399A1

专利类型
公开/公告日2002-01-24

原文格式PDF
申请/专利权人 KYOCERA CHEMICAL CORPORATION;OTSUKA CHEMICAL CO. LTD.;SUZUKI TETSUAKI;KAZAMA SHINITI;SUGIYAMA TSUYOSHI;KAMIYA HIROKI;KANEMAKI NORIKO;OGAWA KEI;TADA YUJI;
展开▼

申请/专利号WO2001JP06134
发明设计人 SUZUKI TETSUAKI;KAZAMA SHINITI;SUGIYAMA TSUYOSHI;KAMIYA HIROKI;KANEMAKI NORIKO;OGAWA KEI;TADA YUJI;
展开▼

申请日2001-07-16
分类号C08L63/00;B32B15/08;B32B27/38;C08J5/24;C08K5/5399;H05K3/46;
国家 WO
入库时间 2022-08-22 00:37:49

相似文献

专利
外文文献
中文文献