首页> 外国专利> Custom IC hardware modeling using standard ICs for use in IC design validation

Custom IC hardware modeling using standard ICs for use in IC design validation

机译:使用标准IC进行定制IC硬件建模,以用于IC设计验证

摘要

Testing and validation of custom IC designs is performed using standard ICs. Highly complex integrated circuits, instead of being designed at the gates and flops level, are typically designed using standardized cell libraries that allow for widespread, systematic design reuse. Such libraries may include Functional System Blocks, or FSBs (sometimes referred to as ASIC cores), and Application Specific Standard Parts (ASSPs). ASSPs are designs that are or were once realized as stand-alone parts, but that may also be embedded into larger designs (embedded ASSPs). Instead of a conventional software model, testing and validation is performed using a hardware model of a custom integrated circuit. The hardware model may be a breadboard system that is decomposed into three levels of functionality: ASSPs, FSBs and glue logicASSPs are typically 500K gates or more and may be realized as separate ICs. FSBs are typically 50K gates or less. A collection of commonly used FSBs are therefore provided on a single integrated circuit (FSBIC) in such a way that by applying a predetermined control signal to the FSBIC, it will behave as a selected one of the FSBs. The hardware model may use as many FSBICs as required to map to the FSBs in the custom IC design. Logic on the custom IC that is not part of an ASSP or an FSB may be regarded as glue logic. A hardware emulator (e.g., a programmable logic IC) may be used to model the glue logic.
机译:定制IC设计的测试和验证是使用标准IC进行的。高度复杂的集成电路不是在门和触发器级进行设计,而是通常使用标准化单元库进行设计,以实现广泛,系统的设计复用。这样的库可以包括功能系统块或FSB(有时称为ASIC内核)和专用标准部件(ASSP)。 ASSP是已经或曾经实现为独立零件的设计,但也可以嵌入更大的设计(嵌入式ASSP)中。代替常规软件模型,使用定制集成电路的硬件模型执行测试和验证。硬件模型可以是一个面包板系统,可以分解为三个功能级别:ASSP,FSB和粘合逻辑ASSP通常为500K门或更多,可以实现为单独的IC。 FSB通常为50K门或更少。因此,以这样的方式在单个集成电路(FSBIC)上提供常用的FSB的集合,使得通过将预定的控制信号施加到FSBIC,它将表现为FSB中的一个被选择。硬件模型可以使用所需数量的FSBIC来映射到定制IC设计中的FSB。不属于ASSP或FSB的定制IC上的逻辑可被视为粘合逻辑。硬件仿真器(例如,可编程逻辑IC)可以用于对胶合逻辑建模。

著录项

  • 公开/公告号US6338158B1

    专利类型

  • 公开/公告日2002-01-08

    原文格式PDF

  • 申请/专利权人 VLSI TECHNOLOGY INC.;

    申请/专利号US19970962597

  • 发明设计人 ROBERT L. PAYNE;

    申请日1997-10-31

  • 分类号G06F175/00;

  • 国家 US

  • 入库时间 2022-08-22 00:46:32

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号