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MODELING METHOD IN NUMERICAL ANALYSIS APPLYING SEEPAGE FLOW EQUATION

机译:渗流方程数值分析中的建模方法

摘要

PROBLEM TO BE SOLVED: To easily set a material model of a thin layer and the like in numerical analysis for analyzing a concentration diffusion place, a thermal conductive place and an underground water seepage flow.;SOLUTION: In the modeling method of seepage flow numerical analysis, modeling for giving a prescribed material characteristic to the thin layer is performed and analysis is performed if the thin layer exists so that it passes through an element in the model of numerical analysis by applying a seepage flow equation. The thin layer and the element of the layer through which the thin layer passes are converted into the layer te of prescribed thickness and they are analyzed.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:在数值分析中轻松设置薄层等材料模型以分析浓度扩散位置,导热位置和地下水渗流。解决方案:在渗流数值建模方法中分析时,进行建模以使薄层具有规定的材料特性,并且如果存在薄层,则通过应用渗流方程使薄层通过数值分析模型中的元素进行分析。将该薄层和该薄层通过的层的元素转换为预定厚度的te层,并对其进行分析。;版权所有:(C)2002,JPO

著录项

  • 公开/公告号JP2002169791A

    专利类型

  • 公开/公告日2002-06-14

    原文格式PDF

  • 申请/专利权人 SHIMIZU CORP;

    申请/专利号JP20000366601

  • 发明设计人 SHIRAISHI TOMONARI;SAKURAI HIDEYUKI;

    申请日2000-12-01

  • 分类号G06F17/13;G06F17/50;

  • 国家 JP

  • 入库时间 2022-08-22 00:59:03

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