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Bonding failure detection method in bump formation, bonding failure detection device, and bonding device control method
Bonding failure detection method in bump formation, bonding failure detection device, and bonding device control method
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机译：凸点形成中的接合失败检测方法，接合失败检测装置以及接合装置控制方法
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摘要
PROBLEM TO BE SOLVED: To prevent a bonding defect and prevent the clogging of a capillary, by detecting the bonding detect, based on whether the absolute value of the output voltage of a torch power source to apply high voltages is over the preset value or not. SOLUTION: In the case of forming a bump by ball bonding method, the bonding defect is detected, based on whether the absolute vale of the output voltage of a torch power source 1 to apply high voltage is over the preset value or not. Fox example, if a high level of output can be gotten from the comparison circuit by comparing the output voltage value of the torch power source 1 divided with resistors with the judgment criteria voltage value corrected by the value of the resistance by means of a comparison circuit 2, it is judged that it was a misjudge. Then, an RS flip-flop 3 is set with the output of the comparison circuit 2, and is reset by the rest signal from a computer for control after input of data to indicate that it is faulty into the computer of control.
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