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Mounting adapter for ball grid array package, mounting structure of ball grid array package using the same, and repair method of ball grid array package
Mounting adapter for ball grid array package, mounting structure of ball grid array package using the same, and repair method of ball grid array package
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机译：球栅阵列封装的安装适配器，使用该适配器的球栅阵列封装的安装结构以及球栅阵列封装的修复方法
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摘要
The mounting adaptor 50 for the ball grid array package is mounted on the printed board 21, and the ball grid array package 10 is mounted on the ball grid array package mounting surface 54 of the adapter 50. The adapter 50 has a core board 51 made of aluminum, a mounting surface 54 of a ball grid array package having a large number of footprint electrodes 58, a printed circuit board mounting surface 55 having a number of solder bumps 60, and a core plate 51 which is used for repair heat The stay portions 51A and 51B are provided. The solder bump 60 is made of high temperature solder. The heat for repair is extended to the core plate 51, and the solder bumps of the ball grid array package 10 are heated and melted to remove the ball grid array package 10.
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