首页> 外国专利> High resolved position measurement arrangement for light spot on charge coupled device sensor, has wedge plate moved between laser diode and sensor to change refraction spot of laser light on sensor

High resolved position measurement arrangement for light spot on charge coupled device sensor, has wedge plate moved between laser diode and sensor to change refraction spot of laser light on sensor

机译:电荷耦合器件传感器上光斑的高分辨率位置测量装置,楔形板在激光二极管和传感器之间移动,以改变激光在传感器上的折射点

摘要

A wedge plate (1b) is moved on the measurement path (1g) between laser diode (1a) with collimator (1d) and CCD sensor (1c) so as to change refraction spot of laser light on CCD sensor. An Independent claim is also included for light spot position measurement procedure.
机译:使楔形板(1b)在具有准直仪(1d)的激光二极管(1a)和CCD传感器(1c)之间的测量路径(1g)上移动,以改变CCD传感器上的激光的折射点。光点位置测量程序还包括独立索赔。

著录项

  • 公开/公告号DE10003718A1

    专利类型

  • 公开/公告日2001-07-26

    原文格式PDF

  • 申请/专利权人 GORNY KLAUS;

    申请/专利号DE2000103718

  • 发明设计人 GORNY KLAUS;

    申请日2000-01-24

  • 分类号G01B11/00;G01J1/10;

  • 国家 DE

  • 入库时间 2022-08-22 01:10:02

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