首页> 外国专利> Cleaning semiconductor wafers comprises using an aqueous hydrogen fluoride solution acidified with a mineral acid, rinsing with or in pure water and then cleaning with an aqueous ozone solution

Cleaning semiconductor wafers comprises using an aqueous hydrogen fluoride solution acidified with a mineral acid, rinsing with or in pure water and then cleaning with an aqueous ozone solution

机译：清洗半导体晶片包括使用用无机酸酸化的氟化氢水溶液，用纯水冲洗或在纯水中冲洗，然后用臭氧水溶液清洗

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摘要

Cleaning semiconductor wafers comprises using an aqueous hydrogen fluoride solution acidified with a mineral acid, rinsing with or in pure water and then cleaning with an aqueous O3 solution. Preferred Features: The hydrogen fluoride solution is acidified with non-oxidizing mineral acid. The concentration of the mineral acid in the hydrogen fluoride solution is 0.1-5 volume %.

机译：清洁半导体晶片包括使用用无机酸酸化的氟化氢水溶液，用纯水冲洗或在纯水中冲洗，然后用O3水溶液清洁。优选特征：氟化氢溶液用非氧化性无机酸酸化。氟化氢溶液中无机酸的浓度为0.1-5体积％。

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公开/公告号DE19954356A1

专利类型
公开/公告日2001-02-22

原文格式PDF
申请/专利权人 WACKER SILTRONIC GESELLSCHAFT FUER HALBLEITERMATERIALIEN AG;
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申请/专利号DE1999154356
发明设计人 HOHL GEORG-FRIEDRICH;
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申请日1999-11-11
分类号H01L21/306;
国家 DE
入库时间 2022-08-22 01:10:09

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