首页>
外国专利>
SUBSTRATE SUCTION HOLDING METHOD, SUBSTRATE SUCTION HOLDING DEVICE, ALIGNER USING THE SUBSTRATE SUCTION HOLDING DEVICE AND MANUFACTURING METHOD THE DEVICE
SUBSTRATE SUCTION HOLDING METHOD, SUBSTRATE SUCTION HOLDING DEVICE, ALIGNER USING THE SUBSTRATE SUCTION HOLDING DEVICE AND MANUFACTURING METHOD THE DEVICE
展开▼
机译：基板吸持方法，基板吸持设备，使用基板吸持设备的报警器及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide a substrate suction holding method, which obtains the satisfactory planarity of the surface of a substrate, without exerting the effect of the roughness of the rear of the substrate on the surface of the substrate even though the substrate is a substrate, such as a wafer which is large in roughness of its rear surface, and also suction holes the substrate in such a way as to eliminate local strains within the surface of the substrate, and a substrate suction holding device. ;SOLUTION: When a substrate 2 is mounted on protruding parts 3a, formed on a chuck 3 for supporting the substrate 2, such as a wafer, and is suction held on the chuck 3 at a negative pressure, with an electrostatic force or the like, roughness suction member 4 capable of absorbing the roughness of the rear of the substrate are made to be interposed between the upper surfaces of the protruding parts 3a and the rear of the substrate 2. The members 4 are a member, having a longitudinal elastic modulus lower than that of the substrate 2 and the thickness of the members 4, is formed thikcer than 1/2 the PV value of the roughness of the rear surface of the substrate. The members 4 are deformed to fit the roughness of the rear surface of the substrate, the recesses and projections and undulations of the surface of the substrate, which are generated due to the roughness of the rear surface of the substrate, are reduced or relaxed to cause the defocusing of the surface of the substrate and a strain to be reduced within the surface of the substrate.;COPYRIGHT: (C)2001,JPO
展开▼
