首页> 外国专利> PARTIAL ELECTROPLATING DEVICE AND PARTIAL ELECTROPLATING LINE SYSTEM AND CONTINUOUS PARTIAL ELECTROPLATING METHOD USED THEREFOR

PARTIAL ELECTROPLATING DEVICE AND PARTIAL ELECTROPLATING LINE SYSTEM AND CONTINUOUS PARTIAL ELECTROPLATING METHOD USED THEREFOR

机译:局部电镀装置和局部电镀生产线系统以及使用该方法的连续局部电镀方法

摘要

PROBLEM TO BE SOLVED: To provide a partial electroplating device which is capable of embodying partial plating without stopping the take-up of a belt-like sheet.;SOLUTION: The sheet 7 for connectors is held by insulating belts 3 for masking and is transported toward an arrow A. A plating liquid is gushed through a network-like electrode 5 from a plating jet port 6 to the sheet 7 held by the insulating belts 3 for masking and the partial gold plating is applied to the sheet by executing electricity supply at the time of electroplating by a rolled electrode 4 and the network-like electrode 5.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:提供一种局部电镀装置,其能够在不停止带状片材的卷取的情况下实现部分电镀。;解决方案:用于连接器的片材7被绝缘带3掩盖并运输。通过网状电极5将电镀液从电镀喷射口6喷到由绝缘带3保持的用于掩蔽的板7上,并通过在板上进行电力供应将部分镀金施加到板上。卷绕电极4和网状电极5电镀的时间;版权:(C)2000,JPO

著录项

  • 公开/公告号JP2000345385A

    专利类型

  • 公开/公告日2000-12-12

    原文格式PDF

  • 申请/专利权人 NEC CORP;

    申请/专利号JP19990161773

  • 发明设计人 KUJIRAOKA HIDEKI;

    申请日1999-06-09

  • 分类号C25D5/02;C25D7/06;

  • 国家 JP

  • 入库时间 2022-08-22 01:27:43

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