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Non-conductive substrate surfaces, especially polymer resist layer and copper surface regions of circuit boards, are electroplated after precious metal nucleation and contact with an electroless reduction copper bath
Non-conductive substrate surfaces, especially polymer resist layer and copper surface regions of circuit boards, are electroplated after precious metal nucleation and contact with an electroless reduction copper bath
Electroplating of a non-conductive substrate involves contact with an electroless reduction copper bath after precious metal activation and nucleation and before electroplating. A process for metal electroplating of a non-conductive substrate comprises: (a) surface activating with a precious metal colloid stabilized with a group IVa metal compound; (b) treating the activated surface with an alkaline solution containing ions of a metal, which is nobler than the group IVa metal, and a complex-former for the metal ions; (c) contacting the surface with a copper bath containing a copper ion source, a copper ion reducing agent and a copper ion complexing agent, without external current application; and (d) electroplating with a metal layer.
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