首页> 外国专利> Air-cooled electronic device with a circuit board and an integrated circuit module has a heat transmission device to conduct heat by connecting to a heat sink in a cool air channel

Air-cooled electronic device with a circuit board and an integrated circuit module has a heat transmission device to conduct heat by connecting to a heat sink in a cool air channel

机译：具有电路板和集成电路模块的风冷电子设备具有传热装置，该传热装置通过连接到冷气通道中的散热器来传导热量。

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摘要

An electronic device (10) contains a circuit board (14) fitted with a connector, an integrated circuit module (24) fastened to the connector and a heat sink (26). A heat transmission device (18, 30) is fitted at a position separate from the heat sink in a cool air channel. A heat conduction path (20) makes a thermal connection between the heat sink and the heat transmission device.

机译：电子设备（10）包括装配有连接器的电路板（14），固定到该连接器的集成电路模块（24）和散热器（26）。传热装置（18、30）安装在冷气通道中与散热器分离的位置。导热路径（20）在散热器和热传递装置之间形成热连接。

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公开/公告号DE19900534A1

专利类型
公开/公告日2000-02-10

原文格式PDF
申请/专利权人 FUJITSU LTD. KAWASAKI;
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申请/专利号DE1999100534
发明设计人 ISHIMINE JUNICHI;SUZUKI MASAHIRO;
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申请日1999-01-11
分类号H05K7/20;G06F1/20;
国家 DE
入库时间 2022-08-22 01:42:22

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