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Reactive ion or ion beam etching quartz or quartz glass for shaping or structuring, uses a fluorine-containing etching gas and a further fluorine- and/or hydrogen-containing gas in equipment made of inert materials
Reactive ion or ion beam etching quartz or quartz glass for shaping or structuring, uses a fluorine-containing etching gas and a further fluorine- and/or hydrogen-containing gas in equipment made of inert materials
Quartz (glass) surface machining comprises reactive ion (beam) etching with a fluorine-containing etching gas and a further fluorine- and/or hydrogen-containing gas using equipment made of inert materials. Quartz, quartz glass and quartz-like glass substrates are surface machined by reactive ion (beam) etching with a fluorine-containing etching gas and a further fluorine- and/or hydrogen-containing gas, the ions of which are accelerated against the substrate surface to effect etching by the chemically reactive fluorine species and by physical sputtering. The plasma discharge chamber, the optical system of the ion source and the ion beam guiding and/or shaping elements between the ion source and the substrate surface are made of materials which are inert with respect to the chemically reactive fluorine species.
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