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Semiconductor micromechanical sensor, e.g. a pressure sensor, is fixed in a housing by a gel to provide an elastic, viscous or flexible bond and long term protection
Semiconductor micromechanical sensor, e.g. a pressure sensor, is fixed in a housing by a gel to provide an elastic, viscous or flexible bond and long term protection
Semiconductor micromechanical sensor (12) fixed in a housing (11) by (a) positioning sensor on a seating surface (112) in a housing recess (111); (b) simultaneously forming an electrical connection (14) between the sensor and electrical contact (15) on the housing and fixing the sensor to the housing by pressure reduction through a conduit (114); and (c) filling recess with a fixing gel (13). An Independent claim is also included for a sensor structure produced by the above process.
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