首页> 外国专利> Apparatus for sputter coating of substrates with use of variable plasma potential has an additional electrode in at least one plasma space between magnetrons and substrate

Apparatus for sputter coating of substrates with use of variable plasma potential has an additional electrode in at least one plasma space between magnetrons and substrate

机译：利用可变等离子电势对衬底进行溅射涂覆的设备在磁控管和衬底之间的至少一个等离子体空间中具有一个附加电极

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摘要

The apparatus has an additional electrode (5) located in at least one plasma space between the individual magnetrons (3.1, 3.2) and the substrate (2), and is provided with an added positive potential relative to earth.

机译：该设备具有位于单独的磁控管（3.1、3.2）和衬底（2）之间的至少一个等离子体空间中的附加电极（5），并具有相对于地球的增加的正电势。

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公开/公告号DE19830404A1

专利类型
公开/公告日2000-01-27

原文格式PDF
申请/专利权人 VON ARDENNE ANLAGENTECHNIK GMBH;
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申请/专利号DE1998130404
发明设计人 SCHULZE DIETMAR;GEHM KLAUS;DIMER MARTIN;STRUEMPFEL JOHANNES;HECHT HANS-CHRISTIAN;GANTENBEIN PAUL;
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申请日1998-07-08
分类号H01J37/34;C23C14/35;
国家 DE
入库时间 2022-08-22 01:42:45

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