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For AlN substrate electroless Ni-based plating solution
For AlN substrate electroless Ni-based plating solution
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机译：对于AlN衬底化学镀Ni基镀液
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摘要
PURPOSE: To provide the plating solution with which a plated coating film having excellent properties such as film adhesion, hardness, can be formed selectively on only the wiring provided on the AlN substrate by specifying the Ni ion source, complexing agent, second complexing agent and reducing agent used as the components of the plating solution. ;CONSTITUTION: The composition of this plating solution consists of nickel sulfate (or that contg. water of crystallization), nickel chloride or nickel acetate as the Ni ion source, ethylene diamine as the complexing agent, lactic acid as the second complexing agent and sodium hypophosphite as the reducing agent. An appropriate combination of these components is prepared and an acid is added to the resulting composition to adjust its pH and the solution thus obtained is used as the objective plating solution. At the time of performing the plating, the temp. of the plating solution is preferably within the range of 60 to 80°C and the concn. of the Ni ion source in the plating solution is preferably about 0.01 to 0.10 mol/l and also, the concn. of the complexing agent and the second complexing agent in the plating solution are preferably about 0.05 to 0. 20mol/l and about 0. 15 to 0. 30mol/l respectively and further, the concn. of the reducing agent in the plating solution is preferably about 0. 05 to 0. 30mol/l.;COPYRIGHT: (C)1995,JPO
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