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HEAT TRANSFERRING MATERIAL, MATERIAL AND METHOD HEAT RADIATING FOR, AND ELECTRIC AND ELECTRONIC DEVICES

机译:传热材料,材料和方法的热辐射处理以及电气和电子设备

摘要

PROBLEM TO BE SOLVED: To provide a single heat transferring material which has a superior heat radiating characteristic and an ultra light weight and can contain a cooling liquid, such as the water, etc., and a heat radiating material, etc. ;SOLUTION: The base material of a heat transferring material and a heat radiating material is composed mainly of a three-dimensionally communicative porous material of alumina or an alumina alloy, at least partially contains alumina whickers, and has a specific gravity of 0.81-2.43 g/cm3. A heat radiating material preferably has a heat radiation factor of ≥0.62 and a specific gravity of 1.08-1.75 g/cm3, contains a liquid refrigerant in its base material, and the like.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:提供一种具有优良的散热特性和超轻的重量并且可以包含冷却液(例如水等)和散热材料等的单一导热材料;解决方案:传热材料和散热材料的基材主要由氧化铝或氧化铝合金的三维连通多孔材料构成,至少部分包含氧化铝晶须,并且比重为0.81-2.43 g / cm3。 。散热材料的散热系数最好≥0.62,比重最好为1.08-1.75 g / cm3,并且在其基材中包含液态制冷剂等;版权:(C)2000,JPO

著录项

  • 公开/公告号JP2000241095A

    专利类型

  • 公开/公告日2000-09-08

    原文格式PDF

  • 申请/专利权人 TECHNO QUEST:KK;NDC ENGINEERING KK;

    申请/专利号JP19990042333

  • 发明设计人 SUZUKI SHUNSUKE;

    申请日1999-02-19

  • 分类号F28F21/08;C22C1/08;C22C49/14;H05K7/20;

  • 国家 JP

  • 入库时间 2022-08-22 01:59:15

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