首页> 外国专利> CEMENTED CARBIDE FORMED WITH PLANAR CRYSTAL TUNGSTEN- CONTAINING LAYER ON SURFACE, ITS PRODUCTION AND CEMENTED CARBIDE COATED WITH DIAMOND ON SURFACE

CEMENTED CARBIDE FORMED WITH PLANAR CRYSTAL TUNGSTEN- CONTAINING LAYER ON SURFACE, ITS PRODUCTION AND CEMENTED CARBIDE COATED WITH DIAMOND ON SURFACE

机译:表面含平面钨合金层的硬质合金及其生产方法及表面金刚石涂层的硬质合金

摘要

PROBLEM TO BE SOLVED: To prevent the peeling of a diamond layer applied on the surface of an alloy, on the surface, by allowing planar crystal tungsten carbide to have a specified aspect ratio and to be formed in a vertical state and/or an inclined state to the boundary between the alloy inside and the surface layer as the main components.;SOLUTION: This alloy is composed of a surface layer to a thickness of at least 3 μm and an alloy inside. The surface layer contains planar crystal tungsten carbide having ≥3 aspect ratio. Then, among the diffraction rays of tungsten carbide by the X-ray diffraction of the surface in the surface layer, in the case the peak intensity of the (001) crystal face is defined as h(001), and the peak intensity of the (101) crystal face as h(101), the relation expressed by the inequality is valid. Preferably, the content of the planar crystal tungsten carbide in the surface layer is ≥70 vol.% in the whole of the surface layer, and the content of the planar crystal tungsten carbide having ≥6 aspect ratio is ≥50 vol.% in the whole of the surface layer.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:通过允许平面晶体碳化钨具有指定的纵横比并以垂直状态和/或倾斜的方式形成,以防止在合金表面上涂覆的金刚石层剥落。状态:以合金内部和表面层之间的边界为主要成分。;解决方案:该合金由厚度至少为3μm的表面层和内部合金组成。表面层包含纵横比≥3的平面晶体碳化钨。然后,在通过表面层中的表面的X射线衍射的碳化钨的衍射射线中,在将(001)晶面的峰强度定义为h(001)的情况下,将(001)晶面的峰强度定义为h(001)。 (101)晶面为h(101),由不等式表示的关系有效。优选地,在整个表面层中,表面层中的平面晶体碳化钨的含量为≥70vol。%,并且在表面层中具有≥6的长径比的平面晶体碳化钨的含量为≥50vol。%。整个表层。版权所有:(C)2000,JPO

著录项

  • 公开/公告号JP2000119790A

    专利类型

  • 公开/公告日2000-04-25

    原文格式PDF

  • 申请/专利权人 TOSHIBA TUNGALOY CO LTD;

    申请/专利号JP19980292669

  • 发明设计人 SHIBUKI KUNIO;MITSUDA TETSUYA;

    申请日1998-10-15

  • 分类号C22C29/08;B22F3/24;C22C1/05;

  • 国家 JP

  • 入库时间 2022-08-22 01:59:42

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