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METHOD AND DEVICE FOR DECIDING MASK COMMON DEFECTS, AND METHOD AND DEVICE FOR MEASURING AND ELIMINATING MASK COMMON DEFECT CHIPS
METHOD AND DEVICE FOR DECIDING MASK COMMON DEFECTS, AND METHOD AND DEVICE FOR MEASURING AND ELIMINATING MASK COMMON DEFECT CHIPS
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机译：确定面具常见缺陷的方法和装置，以及衡量和消除面具常见缺陷的方法和装置
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摘要
PROBLEM TO BE SOLVED: To shorten wafer measurement time by dividing a wafer map data along the ordinate axis and the abscissa axis, based on the shot map data of a mask and then overlapping the divided parts of the data, and when defective rate at one and the same place exceeds a preliminarily set reference value, by deciding the defect at that place as a mask common defect. ;SOLUTION: Data about the number of chips of one shot of a mask for a wafer product is obtained from a production management host computer 1. From the number of chips in one shot, a one-shot map is calculated and then a map for the entire pattern is calculated to obtain the shot map data of the mask. Next, a wafer test is executed using a semiconductor tester 3, and the test result data are collected in a data management block computer 2. From the wafer map data stored in a data storage section 4 of the data management block computer 2, a chip address is obtained for all the chips. The wafer map data is divided along the ordinate axis and the abscissa axis, based on the shot map data of the mask and the divided parts of the data are overlapped. When defective rate exceeds a reference value, the chip is deemed a common defect chip.;COPYRIGHT: (C)2000,JPO
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