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TEST DATA ANALYZING SYSTEM AND TEST DATA ANALYZING METHOD

机译:试验数据分析系统和试验数据分析方法

摘要

PROBLEM TO BE SOLVED: To recognize a relation between a occurrence state of appearance failure of each chip and a product property of the chip, to analyze new data and to clarify a cause and effect relation between the appearance failure and the product property by analyzing data by chip unit. ;SOLUTION: A foreign substance data analyzing station 2 and an appearance failure data analyzing station 5 have chip arranging information for each product kind, to which chip an appearance failure belongs is judged by a detected appearance failure coordinate and how many appearance failures occurred is counted for each chip. The foreign substance data analyzing station 2 and the appearance failure data analyzing station 5 analyze based upon the number of outward failures, a coordinate and a number of appearance failures within the chip on a wafer. Also the foreign substance data analyzing station 2 and the appearance failure data analyzing station 5 analyze based upon the number of outward failures, a coordinate and the number of appearance failures within the chip and product property data for each chip read from a probe test data analyzing station 8 on the wafer.;COPYRIGHT: (C)2000,JPO
机译:要解决的问题:识别每个芯片的外观故障的发生状态与芯片的产品特性之间的关系,分析新数据并通过分析数据来弄清外观故障与产品特性之间的因果关系按芯片单位。 ;解决方案:异物数据分析站2和外观故障数据分析站5具有每种产品类型的芯片排列信息,通过检测到的外观故障坐标来判断外观故障属于哪个芯片,并计算发生了多少次外观故障每个芯片。异物数据分析站2和外观故障数据分析站5基于晶片上的芯片内的向外故障的数量,坐标和外观故障的数量进行分析。此外,异物数据分析站2和外观故障数据分析站5还基于从探针测试数据分析读取的外部故障的数量,芯片内的外观故障的坐标和外观以及每个芯片的产品特性数据进行分析。晶圆上的第8工位;版权所有:(C)2000,JPO

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