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konpiyu - hi for ta - toshinku device

机译:伊势·康比尤·希福塔·东新久

摘要

PROBLEM TO BE SOLVED: To provide a metallic heat sink for a semiconductor component mounted on a printed circuit board which does not emit electromagnetic radiation which might obstruct the operation of a logical circuit mounted on the printed circuit board. ;SOLUTION: This is a heat sink device 24 for a microprocessor 20 mounted on a printed circuit board 22 including a ground face 34, and this is heat conductive, and this is a heat sink device which is equipped with an external surface fixed to the top of a dielectric case with a built-in microprocessor and enables heat exchange with surrounding air. The heat sink device 24 includes a Faraday type of radiation interrupting means which prevents the above device working as an antenna from emitting again the electromagnetic radiation that it received from the microprocessor 20, and connections means 28, 30, and 32 for connecting the above device to the earth face 34 so as to discharge the energy induced by electromagnetic radiation.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:为安装在印刷电路板上的半导体组件提供一种金属散热片,该金属散热器不发射电磁辐射,电磁辐射可能会妨碍安装在印刷电路板上的逻辑电路的运行。 ;解决方案:这是用于微处理器20的散热器设备24,该散热器设备24安装在包括接地面34的印刷电路板22上,并且具有导热性,并且是散热器设备,其外表面固定在散热器上。内置微处理器的介电盒顶部,可与周围空气进行热交换。散热器装置24包括:法拉第(Faraday)型辐射中断装置,该装置阻止用作天线的上述装置再次发射从微处理器20接收的电磁辐射;以及连接装置28、30和32,用于连接上述装置。到地表34上以释放电磁辐射感应的能量。版权所有:(C)1999,日本特许厅

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