PROBLEM TO BE SOLVED: To provide a metallic heat sink for a semiconductor component mounted on a printed circuit board which does not emit electromagnetic radiation which might obstruct the operation of a logical circuit mounted on the printed circuit board. ;SOLUTION: This is a heat sink device 24 for a microprocessor 20 mounted on a printed circuit board 22 including a ground face 34, and this is heat conductive, and this is a heat sink device which is equipped with an external surface fixed to the top of a dielectric case with a built-in microprocessor and enables heat exchange with surrounding air. The heat sink device 24 includes a Faraday type of radiation interrupting means which prevents the above device working as an antenna from emitting again the electromagnetic radiation that it received from the microprocessor 20, and connections means 28, 30, and 32 for connecting the above device to the earth face 34 so as to discharge the energy induced by electromagnetic radiation.;COPYRIGHT: (C)1999,JPO
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