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How to plate palladium or palladium alloy on iron-nickel alloy material
How to plate palladium or palladium alloy on iron-nickel alloy material
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机译：如何在铁镍合金材料上镀钯或钯合金
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摘要
A method of palladium plating and palladium alloy plating on a semiconductor lead frame made of an iron-nickel alloy material is disclosed. The method includes a copper plating layer, a nickel tin alloy plating layer, or a copper tin alloy plating layer on a plated body of an iron-nickel alloy material. It is characterized in that the primary base plated to form, and the secondary base plated to form a nickel plated layer, gold alloy plated layer thereon and then palladium plated or palladium alloy plated, except that when the primary base plated layer is a copper plating layer, the secondary base plated layer is gold Alloy plating layer. Since the three-stage plating layer according to the present invention is made of a thin film, even in the case of a high-capacity high pin lead frame, the leads do not adhere to each other and the metal particles are much finely electrodeposited so that hydrogen embrittlement is almost impossible. It is possible to obtain a flexible plating layer having no microcracks and exhibits excellent adhesion, corrosion resistance and solderability. In addition, there are no problems such as silver discoloration and emission of pollutants caused by lead in the existing plating process.
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