首页>
外国专利>
LEAD FRAME FOR SEMICONDUCTOR PACKAGE HAVING FUSED LEAD WHREEIN SHAPE OF STRESS ABSORBING MEANS
LEAD FRAME FOR SEMICONDUCTOR PACKAGE HAVING FUSED LEAD WHREEIN SHAPE OF STRESS ABSORBING MEANS
展开▼
机译：具有应力吸收装置形状的熔融铅铅合金的半导体封装的铅框架
展开▼
页面导航
摘要
著录项
相似文献
摘要
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame for a semiconductor package having a fuse lead, and in particular, a lead frame for a semiconductor package having stress absorbing means formed in a fuse lead, which is integrally connected to the semiconductor chip mounting plate 2. By forming stress absorbing means 5 of various shapes in front or rear of the fuse lead 3 to be absorbed to minimize the deformation of the lead frame (1) by absorbing the residual stress generated by the downset, stress absorbing means By forming a ground bonding region 7 in which a portion of (5) is silver-plated, the bonding force between the molding resin and the lead frame 1 due to the minimization of the silver plating region can be improved, thereby improving reliability in manufacturing a semiconductor package. Can be achieved.
展开▼
