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Anisotropic conductive material, a method to electrically connect between the electrodes using the anisotropic conductive adhesive and the anisotropic conductive adhesive and the electric circuit substrate formed by the method
Anisotropic conductive material, a method to electrically connect between the electrodes using the anisotropic conductive adhesive and the anisotropic conductive adhesive and the electric circuit substrate formed by the method
PURPOSE:To electrically connect electrodes at an excellent insulation rate between adjacent electrodes and at an excellent vertical conductive rate by applying pressure to anisotropic conductive material, where an insulating grain is attached to the surface of a conductive grain, placed between electrodes opposed to each other. CONSTITUTION:A substrate 2 having an electrode 1 and an IC chip 4 having an electrode 3 are made to be opposed to each other so that anisotropic conductive adhesive is placed between the respective electrodes by means of printing or coating, and thereafter, the insulating grains in the adhesive are pressed to such an extent that the conductive grains 5 attached to the surface thereof are diffused in a signal layer. If this pressure is continuously applied or again applied, the insulating grains attached to the sides of both the electrodes of conductive grains are removed from the conductive grains with the result that the upper and lower portions of the conductive grain come into contact with both the electrodes and the electrodes are electrically connected. If the adhesive is heated or an electromagnetic wave is radiated to the adhesive while the condition of pressure application is kept, the adhesive compound 6 is hardened and shrinked and the conductive grains are stressed, so that the IC chip electrode 3 and the electrode 1 of the substrate become conductive and are closely adhered.
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