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ELECTROLESS TIN AND TIN ALLOY PLATING BATH, ELECTROLESS PLATING AND ELECTRONIC PART COATED WITH TIN OR TIN ALLOY FILM IN THE ELECTROLESS PLATING BATH
ELECTROLESS TIN AND TIN ALLOY PLATING BATH, ELECTROLESS PLATING AND ELECTRONIC PART COATED WITH TIN OR TIN ALLOY FILM IN THE ELECTROLESS PLATING BATH
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机译：无锡电镀锡和锡合金镀液，无电镀锡和镀有锡或锡合金膜的电子零件
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摘要
PROBLEM TO BE SOLVED: To decrease the growing activity of a dendrite in a plating film to be formed, to increase film forming property and joining strength and to improve reliability of a high-density product such as a fine pitch printed circuit board by adding a phosphorus compd. to a plating bath. ;SOLUTION: The plating bath consists of a soluble salt of either a stannous salt or a mixture of stannous salt and a specified metal such as bismuth, zinc and copper, and one of org. acids such as org. sulfonic acid and carboxylic acid and inorg. acids such as hydrochloric acid and sulfuric acid, and a complexing agent, and a dendrite inhibitor comprising a phosphorus compd. The phosphorus compd. is selected from inorg. phorphorus compds. such as orthophosphoric acid, pyrophosphoric acid, polyphosphoric acid, hypophosphorous acid, phosphorus acid, and their salts and org. phosphorus compds. such as methylene phosphonic acid, alkylphosphate and their salts. The phosphorus compd. may be used in a single state or a mixture and is added by 0.01 to 100 g/l, preferably 0.1 to 5 g/l in the plating bath.;COPYRIGHT: (C)1999,JPO
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机译：要解决的问题：通过添加增塑剂来降低枝晶在所要形成的镀膜中的生长活性，提高成膜性和接合强度并提高高密度产品（如精细间距印刷电路板）的可靠性。含磷量到电镀液;解决方案：电镀液由亚锡盐或亚锡盐与特定金属（例如铋，锌和铜）和一种有机金属的混合物组成的可溶性盐组成。酸，如org。磺酸和羧酸及无机盐。盐酸和硫酸等酸，络合剂和包含磷的树枝状抑制剂。磷含量高。是从inorg中选择的。 phorcompus。如正磷酸，焦磷酸，多磷酸，次磷酸，亚磷酸及其盐和有机基。磷化合物例如亚甲基膦酸，烷基磷酸酯及其盐。磷含量高。可以以单一状态或混合物形式使用，并在镀浴中以0.01至100 g / l，优选0.1至5 g / l的比例添加。版权所有：（C）1999，JPO
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