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METHOD AND SYSTEM FOR INTRUDING LIQUID INTO FINE RECESS AND PLATING METHOD FOR FINE RECESS
METHOD AND SYSTEM FOR INTRUDING LIQUID INTO FINE RECESS AND PLATING METHOD FOR FINE RECESS
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机译：将液体引入精细过程的方法和系统以及精细过程的放置方法
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摘要
PROBLEM TO BE SOLVED: To enable various liquids, e.g., plating liquid, to penetrate inside fine recesses. ;SOLUTION: This system for introducing liquid into fine recesses comprises a liquid-containing means 20 for introducing a plating liquid, such that the surface at a part of a semiconductor wafer 100 provided with fine recesses 101 touches the plating liquid, a means 70 for heating residual gas in the fine recesses 101 of the semiconductor wafer 100, and a means 50 for controlling the pressure of the plating liquid introduced into the liquid-containing means 20 at a specified level. After the plating liquid has been introduced into the liquid-containing means 20, residual gas in the fine recess 101 is heated by the heating means 70 and the plating liquid filled in the liquid containing means 20 is at the same time pressurized by the pressure control means 50. Subsequently, residual gas in the fine recesses 101 is expanded and driven out therefrom, by reducing the pressure of the plating liquid through the pressure control means 50 and the plating liquid is made to penetrate.;COPYRIGHT: (C)1999,JPO
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