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Selective gold plating of base layer-coated substrate to allow gold and aluminium wire bonding to same substrate
Selective gold plating of base layer-coated substrate to allow gold and aluminium wire bonding to same substrate
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机译：镀有基层的基材的选择性镀金，可将金线和铝线键合到同一基材上
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摘要
A process for gold coating of a substrate (1) bearing a base layer (2), in order to form gold-coated first contact areas (2a-c) and gold-free second contact areas (3a-c), involves temporarily covering the second contact areas and then placing the substrate in an exchange gold plating bath. The novelty is that the gold bath has an electrolyte which causes no gold deposition on the base layer (2). Preferably, the base layer is a chemical nickel layer (2) and the gold bath is a reductive gold plating bath, the electrolyte of which preferably contains 0.1-20 g/l potassium, sodium or ammonium gold(I) cyanide or gold(III) cyanide, 0.1-25 g/l free potassium, sodium or ammonium cyanide, 0.1-50 g/l potassium, sodium or ammonium sulphite, 0.01-10 g/l aromatic nitro compound, 1-100 g/l free alkali, 1-50 g/l complex former(s) selected from hydroxycarboxylic acids, phosphonic acids, nitriloacetic acids and ethylenediamineacetic acids and 0.1-50 g/l borane and/or boranate reducing agent.
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机译：为了形成具有基层（2）的衬底（1）的金涂层，以形成金涂层的第一接触区域（2a-c）和无金的第二接触区域（3a-c），该方法包括暂时覆盖。第二接触区域，然后将基板放置在交换金镀浴中。新颖之处在于，金浴中的电解液不会在基层（2）上沉积金。优选地，基础层是化学镍层（2），并且金浴是还原性镀金浴，其电解质优选包含0.1-20g / l的氰化钾（I），氰化金（I）或金（III）。 ）氰化物，0.1-25 g / l的游离氰化钾，钠或铵，0.1-50 g / l的亚硫酸钾，钠或铵，0.01-10 g / l的芳香硝基化合物，1-100 g / l的游离碱，1 -50 g / l选自羟基羧酸，膦酸，次氮基乙酸和乙二胺乙酸的络合剂和0.1-50 g / l硼烷和/或硼酸酯还原剂。
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