Thermally and electrically reinforced plastic pin grid array (PPGA) packages (THERMALLY AND ELECTRICALLY ENHANCED PLASTIC PIN GRID ARRAY (PPGA) PACKAGE)
展开▼
机译：热电加固塑料引脚网格阵列（PPGA）封装（热电增强塑料引脚网格阵列（PPGA）封装）
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention is an integrated circuit package (10) comprising an integrated circuit (12) and a multilayer printed circuit board (16) coupled to a plurality of external mounting pins (14). The multilayer circuit board 16 has a plurality of internal bonding pads 46 coupled to the integrated circuit 12 and routed directly to the pins 14 without the use of any bias. Because the printed circuit board 16 has multiple voltage / ground layers 20, 22, 24, 26 and 28, different power levels can be supplied to the integrated circuit board 12. The integrated circuit board 12 is mounted to the thermal slug 52, which is also coupled to the printed circuit board 16, and is electrically grounded. The thermal slug 52 provides a dual function of a ground plane and a thermal sink for the package 10. Pin 14 and package 10 are typically shaped in a conventional PPGA package arrangement.
展开▼
