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Chip carriers for fabricating a high power microwave semiconductor device by placing a semiconductor chip thereon
Chip carriers for fabricating a high power microwave semiconductor device by placing a semiconductor chip thereon
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机译：通过在其上放置半导体芯片来制造高功率微波半导体器件的芯片载体
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摘要
A chip carrier (2) comprises a conductive holder (21) having a chip mounting portion (20), and a insulative collar member (22) having an inner portion. The conductive holder (21) is used to mount a semiconductor chip (1) on the chip mounting portion (20). The shape of the inner portion of the insulative collar member (22) is suitable for an outer shape of the semiconductor chip (1). The insulative collar member (22), which is provided at the periphery of the conductive holder (21), is used to position the semiconductor chip (1). Consequently, the handling of the semiconductor chip (1) having a feeble mechanical strength can be converted to the handling of the chip carrier (2) having a hard mechanical strength, so that the semiconductor chip (1) can be easily mounted on a exact portion of a surface of the package (4) without breaking the semiconductor chip (1).
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