首页> 外国专利> Base composition for photolithography resist and resist material for photolithography patterning

Base composition for photolithography resist and resist material for photolithography patterning

机译:用于光刻胶的基础组合物和用于光刻图案化的抗蚀剂材料

摘要

It is possible to reduce adverse effects caused by the reflected light from the substrate and to perform pattern exposure of the photoresist layer with respect to the ultraviolet light without intermixing between layers or undesirable shape of notching, A grounding composition for forming a ground layer having a large selection ratio of etching rate between a patterned resist layer and an underlying layer in a dry etching treatment. The grounding composition of the present invention comprises (A) at least one non-A benzophenone compound or an aromatic azomethine compound having a substituted or alkyl-substituted amino group on an aryl group, and (B) a melamine compound having at least two methylol groups or alkoxymethyl groups bonded to the nitrogen atom in the molecule (A): (B) in a weight ratio of 1: 1 to 1:10.
机译:本发明涉及一种用于形成接地层的接地组合物,其可以减少由来自基板的反射光引起的不利影响,并且可以相对于紫外线进行光致抗蚀剂层的图案曝光,而不会在各层之间相互混合或形成不希望的切口形状。在干蚀刻处理中,在图案化的抗蚀剂层和下层之间的蚀刻速率的大选择比。本发明的接地组合物包含(A)至少一种在芳基上具有取代或烷基取代的氨基的非-A二苯甲酮化合物或芳族偶氮甲碱化合物,和(B)具有至少两个羟甲基的三聚氰胺化合物。与分子(A):( B)中的氮原子键合的基团或烷氧基甲基的重量比为1:1至1:10。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号