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Copper alloys and palladium-tin alloy plating compositions and plating methods of iron-nickel alloys

机译:铜合金和钯锡合金的镀层组成和铁镍合金的镀层方法

摘要

A palladium-tin alloy plating composition of a copper alloy and an iron-nickel alloy, a plating method thereof, and a plating body thereof. The palladium-tin alloy plating composition comprises an aqueous solution containing 5-20 g / l of palladium, 2-8 g / l of tin, 20-100 g / l of at least one conductive salt and 2-10 g / l of complexing agent, 0.1-0.5 g / l and a stress reducing agent 0.05-0.2 g / l. The palladium-tin alloy plating method is carried out by immersing the copper alloy and iron-nickel alloy material into the plating composition and then flowing the current to the plated body at 0.7-5 ASD. According to the present invention, a palladium-tin alloy plating layer having excellent solderability and flexibility is formed on a plated body made of a copper alloy and an iron-nickel alloy material, and a two-step process of plating a tin-lead alloy after silver plating, But also eliminates the emission of harmful substances such as lead, thus greatly contributing to environmental problems.
机译:铜合金和铁-镍合金的钯-锡合金镀覆组合物,其镀覆方法及其镀覆体。钯-锡合金电镀组合物包含水溶液,该水溶液包含5-20 g / l的钯,2-8 g / l的锡,20-100 g / l的至少一种导电盐和2-10 g / l的钯。络合剂0.1-0.5 g / l和应力降低剂0.05-0.2 g / l。钯-锡合金镀覆方法是通过将铜合金和铁-镍合金材料浸入镀覆组合物中,然后以0.7-5 ASD的电流流向镀覆体来进行的。根据本发明,在由铜合金和铁镍合金材料制成的镀覆体上形成具有优异的可焊性和挠性的钯-锡合金镀层,并进行镀锡铅合金的两步法。镀银后,还能消除铅等有害物质的排放,从而极大地造成了环境问题。

著录项

  • 公开/公告号KR970070237A

    专利类型

  • 公开/公告日1997-11-07

    原文格式PDF

  • 申请/专利权人 문성수;

    申请/专利号KR19960010629

  • 发明设计人 문성수;

    申请日1996-04-09

  • 分类号C23C18/42;

  • 国家 KR

  • 入库时间 2022-08-22 03:16:14

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