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WIRING BOARD FOR BGA PACKAGE, LEAD FRAME FOR BGA PACKAGE AND MANUFACTURE OF BGA PACKAGE
WIRING BOARD FOR BGA PACKAGE, LEAD FRAME FOR BGA PACKAGE AND MANUFACTURE OF BGA PACKAGE
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机译：BGA封装的接线板，BGA封装的引线框架和BGA封装的制造
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摘要
PROBLEM TO BE SOLVED: To obtain a BGA package in which material costs regarding its manufacture are reduced, in which the drying process of an adhesive is not required, whose productivity is enhanced and whose quality is enhanced. ;SOLUTION: A wiring board 1, as an individual piece, in which holes 2 have been formed at four corners is placed on a die 5 comprising a recessed groove 5a, lead ends 4 which are directed to the inside in four directions of a lead frame are aligned with the holes 2 in the wiring board 1, as the individual piece, the lead ends 4 are pressed by a press 6 so as to be bent and worked, and the wiring board 1 as the individual piece is bonded to the lead frame.;COPYRIGHT: (C)1997,JPO
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