首页> 外国专利> NOZZLE OPENING/CLOSING APPARATUS FOR DISCHARGING LIQUID FLUID MATERIAL CONTAINING POWDER/GRANULAR MATERIALS AND PACKING APPARATUS FOR FIXED AMOUNT OF PASTE CONTAINING POWDER/GRANULAR MATERIALS

NOZZLE OPENING/CLOSING APPARATUS FOR DISCHARGING LIQUID FLUID MATERIAL CONTAINING POWDER/GRANULAR MATERIALS AND PACKING APPARATUS FOR FIXED AMOUNT OF PASTE CONTAINING POWDER/GRANULAR MATERIALS

机译:排出粉状/颗粒状液体材料的喷嘴开闭装置和粉状/颗粒状固定浆糊的包装装置

摘要

PROBLEM TO BE SOLVED: To prevent solder granulates from being crushed and improve the accuracy of the packing of a fixed amount of soldering paste when the soldering paste is introduced, by using two nozzles, i.e., a large one and a small one, in combination, which are so constructed that each nozzle formed into a flexible tube shape is choked by a side pressure. SOLUTION: A nozzle opening/closing apparatus 5 is constructed by disposing reciprocatively a pair of press bodies 5a, 5a on both sides of a nozzle formed into a rubber or a plastic tube shape and made of a flexible material. Each press body has a width broader than a diameter of the tube, and a top end thereof is sharp triangularly in a cross section. The respective press bodies 5a, 5a are movably fitted into guide cylinders 5b, 5b fixed to a frame 1a and are connected to piston rods 5d, 5d of air cylinder units 5c, 5c. Two of the nozzle opening/closing apparatus 5 having such a construction, i.e., a large one and a small one, are provided in parallel with each other, and the most part of soldering paste is introduced by a large nozzle, while a minute amount thereof is introduced by a small nozzle, whereby a fixed amount of soldering paste can be introduced accurately without crushing solder granulates in the paste.
机译:解决的问题:引入焊膏时,通过使用两个大喷嘴和一个小喷嘴的组合,以防止焊料颗粒被压碎并提高固定量焊膏的包装精度。喷嘴被构造成使得形成为挠性管形状的每个喷嘴被侧压力阻塞。解决方案:喷嘴打开/关闭装置5是通过在一对由橡胶或塑料制成的且由柔性材料制成的喷嘴的两侧往复地放置一对压力体5a,5a而构成的。每个压力机本体的宽度均大于管的直径,并且其顶端的横截面呈三角形。各个挤压体5a,5a可移动地装配到固定在框架1a上的导向缸5b,5b中,并与气缸单元5c,5c的活塞杆5d,5d连接。具有这种结构的两个喷嘴开闭装置5,即大的和小的,彼此平行设置,并且焊膏的大部分由大的喷嘴引入,而微量其通过小喷嘴引入,从而可以精确地引入固定量的焊膏,而不会压碎焊膏中的焊料颗粒。

著录项

  • 公开/公告号JPH0948402A

    专利类型

  • 公开/公告日1997-02-18

    原文格式PDF

  • 申请/专利权人 TAMURA KAKEN KK;

    申请/专利号JP19950222759

  • 发明设计人 MITSUFUJI SHINJI;HOTTA TOKIO;

    申请日1995-08-09

  • 分类号B65B3/28;B65B3/10;

  • 国家 JP

  • 入库时间 2022-08-22 03:34:34

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