The invention relates to a high density assembly of integrated circuits, of the MCM (multi-chip modules) type, the assembly being of high reliability by design and by the means used in its production. The essential characteristic of the assembly is the presence of one (or more) interconnection substrate (s) (11), in addition to at least one substrate (1) carrying a plurality of chips (3, 4 ) bare electronics, these chips being connected to the interconnection substrate (s) by conventional micro-wiring techniques, preferably through one or more window (s) (12) formed in this (s) substrate (s) s) (11). Advantageously, the interconnection substrate (s) (11) is (are) of the multilayer type. The assembly is intended to be then encapsulated in an airtight container in a conventional manner for MCMs.
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