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ADHESIVE FILM FOR MANUFACTURING MULTILAYER WIRING BOARD WITH IVH AND MULTILAYER WIRING BOARD WITH IVH
ADHESIVE FILM FOR MANUFACTURING MULTILAYER WIRING BOARD WITH IVH AND MULTILAYER WIRING BOARD WITH IVH
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机译：用于制造IVH多层接线板和IVH多层接线板的胶粘膜
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摘要
PURPOSE: To completely prevent the squeezing out of resin from an IVH by a method wherein an adhesive film, which is composed of a substrate film and a bonding agent, is adhered to a wiring board, which becomes an IVH, and a multilayer adhesion state is obtained. ;CONSTITUTION: As an adhesive film 3 blocks up the through hole 2 of an IVH (interstitial via hole) 1 and an adhesive agent 9 is closely adhered to the circumference of the through hole, the resin coming from the prepreg and the adhesive film 3 passing the through hole 2 of the IVH is stopped there, the squeezing out of the resin can be prevented. Also, a substrate film 8 and the adhesive agent 9 absorb the irregularity in thickness of a substrate 5 and the inclination of pressure, the projection of inner layer circuit configuration to the surface can be eliminated, and air is not left in the through hole because the air confined in the through hole 2 is diffused to the adhesive agent 9.;COPYRIGHT: (C)1995,JPO
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