PURPOSE:To facilitate drive of a micro-processing member by a method wherein the micro-processing member enabling a base plate to mechanically displace by a very low size in the direction of thickness is integrally mounted in a cantileverform manner, and the micro-processing member is irradiated with emission light from a semiconductor laser emission chip. CONSTITUTION:A micro-processing member formed by deposition of a metallic film 2 to silicon oxide 1 is integrally mounted in a cantileverform manner on a base plate 3 formed by, for example, silicon, to form a micromechanism. In the micromechanism, the microprocessing member is widely warped toward the deposition side by means of a residual stress because of the metallic film being deposited. In vibration in a direction X of the micro-processing member, a semiconductor laser emission chip 4 is disposed on the base plate 3. By means of heat energy of emission light from the emission chip 4, the micro-processing member is vibrated.
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