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Method for fabricating vertical bipolar junction transistors in silicon bonded to an insulator
Method for fabricating vertical bipolar junction transistors in silicon bonded to an insulator
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机译：在结合到绝缘体的硅中制造垂直双极结型晶体管的方法
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摘要
A method is provided for manufacturing a bipolar transistor, comprising theteps of: 1) abutting a polished surface of a substantially single crystal silicon wafer with a polished surface of an insulating substrate; 2) heating the abutting silicon wafer and insulating substrate at about 200° C. for about 30 minutes to form a bonded wafer having a silicon layer; 3) forming a silicon island from the silicon layer; 4) ion implanting a first dopant species having a first conductivity into the silicon island to form a base region in the silicon island; 5) ion implanting a second dopant species having a second conductivity opposite the first conductivity into the silicon island to form an emitter region and a collector region in the silicon island; 6) ion implanting a third dopant species having the first conductivity into the base region of the silicon island; 7) heating the bonded wafer at a temperature of about 800° C. to activate the first, second, and third dopant species and to repair ion implanting damage to the silicon island; 8) forming electrical contacts to the base, emitter, and collector regions; and 9) forming an oxide layer over the electrical contacts to passivate the electrical contacts.
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