High thermal conductivity diamond/non-diamond composite materials

• 1. 一种能够提高导热性的金刚石石墨烯复合材料的制备方法 [P] . 中国专利： CN114015196A . 2022-02-08
• 2. 一种高导热金刚石/Cu-Ni复合材料热沉的制备方法 [P] . 中国专利： CN111676382B . 2021.08.06
• 3. High thermal conductivity diamond/non-diamond composite materials [P] . 美国专利： US5270114A . 1993-12-14

  机译： 高导热金刚石/非金刚石复合材料

• 4. Diamond/non-diamond materials with enhanced thermal conductivity [P] . 美国专利： US5316842A . 1994-05-31

  机译： 导热系数更高的金刚石/非金刚石材料

• 5. Nanostructured metal-diamond composite thermal interface material (TIM) with improved thermal conductivity [P] . 美国专利： US8900704B1 . 2014-12-02

  机译： 具有改善的导热性的纳米结构金属-金刚石复合热界面材料（TIM）

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• 5. Effect of titanium and zirconium carbide interphases on the thermal conductivity and interfacial heat transfers in copper/diamond composite materials [O] . Clio Azina, Iñaki Cornu, Jean-François Silvain, 2019
• 6. Effect of Microstructure on the Thermal Conductivity of ZnS/Diamond Composites [R] . Every, A. G., Tzou, Y., Hasselman, D. P., 1991

• 1. Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method [J] . CHEN Chao GUO Hong CHU Ke YIN Fazhang ZHANG Ximing HAN Yuanyuan FAN Yeming . 稀有金属：英文版 . 2011,第4期
• 2. Microstructural evolution and thermal conductivity of diamond/Al composites during thermal cycling [J] . Ping-ping Wang ,Guo-qin Chen ,Wen-jun Li . 矿物冶金与材料学报 . 2021,第011期
• 3. Predicted interfacial thermal conductance and thermal conductivity of diamond/Al composites with various interfacial coatings [J] . LIANG Xuebing ,JIA Chengchang ,CHU Ke . 稀有金属：英文版 . 2011,第5期
• 4. Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration [J] . Hui Chen ,Cheng-chang Jia ,Shang-jie Li . 矿物冶金与材料学报 . 2013,第002期
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• 6. 复合电沉积制备金刚石/Cu高导热复合材料--增强相金刚石颗粒含量及分布状态研究 [A] . 李博 . 2013