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Method of mounting of the micromodules and its application to the embodiment of a chip cards.

机译:微型模块的安装方法及其在芯片卡实施例中的应用。

摘要

The encarding process uses micromodules of completely defined shapes. In order to produce the body 20 of the card by calendering several polymer sheets 5, 6, 7 and 8, the sheets are previously cut out in order to form therein a cavity corresponding exactly to the volume of micromodule intended to be inserted therein. The micromodule 10 is set in place and a hot-calendering makes it possible to obtain a connection interface, between the micromodule and the polymer of the body of the card, with no creep. Moreover, the surface of the body of the card is kept flat and able to receive a magnetic strip. The invention applies to the production of microchip cards. IMAGE
机译:加密过程使用完全定义形状的微模块。为了通过压延几个聚合物片材5、6、7和8来生产卡的主体20,预先切出片材,以便在其中形成与要插入其中的微模块的体积完全对应的空腔。微模块10被放置在适当的位置,并且热压延使得可以在微模块和卡的主体的聚合物之间获得连接界面而没有蠕变。而且,卡体的表面保持平坦并能够容纳磁条。本发明适用于微芯片卡的生产。 <图像>

著录项

  • 公开/公告号FR2644630B1

    专利类型

  • 公开/公告日1994-05-27

    原文格式PDF

  • 申请/专利权人 SGS THOMSON MICROELECTRONICS SA;

    申请/专利号FR19890003605

  • 发明设计人 FRANCIS STEFFEN;

    申请日1989-03-20

  • 分类号H01L21/52;G06K19/00;

  • 国家 FR

  • 入库时间 2022-08-22 04:34:03

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