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Method of mounting of the micromodules and its application to the embodiment of a chip cards.
Method of mounting of the micromodules and its application to the embodiment of a chip cards.
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机译:微型模块的安装方法及其在芯片卡实施例中的应用。
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摘要
The encarding process uses micromodules of completely defined shapes. In order to produce the body 20 of the card by calendering several polymer sheets 5, 6, 7 and 8, the sheets are previously cut out in order to form therein a cavity corresponding exactly to the volume of micromodule intended to be inserted therein. The micromodule 10 is set in place and a hot-calendering makes it possible to obtain a connection interface, between the micromodule and the polymer of the body of the card, with no creep. Moreover, the surface of the body of the card is kept flat and able to receive a magnetic strip. The invention applies to the production of microchip cards. IMAGE
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