METHOD OF ANISOTROPICALLY ETCHING SILICON WAFERS AND WAFER ETCHING SOLUTION

• 1. 半导体刻蚀设备和碳化硅晶片的刻蚀方法 [P] . 中国专利： CN112921404A . 2021-06-08
• 2. 一种半导体集成电路用硅晶片刻蚀方法 [P] . 中国专利： CN108648995B . 2021.03.19
• 3. Improved method of anisotropically etching silicon wafers and wafer etching solution [P] . 欧洲知识产权局专利： EP0421093B1 . 1995-10-11

  机译： 各向异性蚀刻硅晶片的方法和晶片蚀刻溶液

• 4. IMPROVED METHOD OF ANISOTROPICALLY ETCHING SILICON WAFERS AND WAFER ETCHING SOLUTION [P] . AU636388B2 . 1993-04-29

  机译： 各向异性刻蚀硅晶圆的改进方法及晶圆刻蚀解决方案

• 5. Improved method of anisotropically etching silicon wafers and wafer etching solution [P] . 欧洲知识产权局专利： EP0421093A1 . 1991-04-10

  机译： 各向异性蚀刻硅晶片的方法和晶片蚀刻溶液

• 1. Investigation of material removal characteristics of Si(100)wafer during linear field atmospheric-pressure plasma etching [J] . Weijia Guo, Senthil Kumar A., Peng Xu 纳米技术与精密工程（英文） . 2020,第004期
• 2. Heuristic tabu search scheduling algorithm for wet-etching systems in semiconductor wafer fabrications [J] . Zhou Binghai, Li Xin 高技术通讯（英文版） . 2013,第002期
• 3. A COST-EFFECTIVE METHOD TO FABRICATE THROUGH-SILICON VIAS USING ANISOTROPIC WET ETCHING OF (100) SILICON WAFERS [C] . Ramachandran K. Trichur, Xie Shao SMTA international conference . 2008
• 4. Electrical through-wafer interconnects and microfabricated cantilever arrays using through-wafer silicon etching. [D] . Chow, Eugene Michael. 2001
• 5. Effect of Isopropyl Alcohol Concentration and Etching Time on Wet Chemical Anisotropic Etching of Low-Resistivity Crystalline Silicon Wafer [O] . Eyad Abdur-Rahman, Ibrahim Alghoraibi, Hassan Alkurdi 2017
• 6. Alkali anisotropic chemical etching of p-silicon wafer [O] . Hussien. A. Motaweh 2016

• 1. Investigation of material removal characteristics of Si (100) wafer during linearfield atmospheric-pressure plasma etching [J] . Weijia Guo ,Senthil Kumar A. ,Peng Xu . 纳米技术与精密工程 . 2020,第004期
• 2. A New Model for the Etching Characteristics of Corners Formed by Sisub{111}/subPlanes on Sisub{110}/subWafer Surface [J] . Prem Pal ,Sajal Sagar Singh . 工程（英文）（1947-3931） . 2013,第11期
• 3. Etching Study of SiC Wafers [J] . Li Juan Wang Yingmin Chen Xiufang Xu Xiangang Hu Xiaobo Jiang Minhua . 稀土学报：英文版 . 2006,第z1期
• 4. 各向异性刻蚀具有高暴露(101)面TiO2空心微球及光电性能 [C] . Hao Pan ,潘浩 ,Luo Tu . 第十三届全国有机分子电化学与工业学术会议 . 2012
• 5. 基于条纹反射的太阳能电池硅晶片表面质量检测方法研究 [A] . 李明阳 . 2016