首页> 外国专利> CORE MATERIAL HAVING LOW THERMAL-EXPANSION COEFFICIENT AND LOW PERMITTIVITY IN LASER PROCESSING FOR ELECTRONIC CIRCUIT PACKAGE AND MANUFACTURE OF CORE MATERIAL AND ELECTRONIC CIRCUIT PACKAGE

CORE MATERIAL HAVING LOW THERMAL-EXPANSION COEFFICIENT AND LOW PERMITTIVITY IN LASER PROCESSING FOR ELECTRONIC CIRCUIT PACKAGE AND MANUFACTURE OF CORE MATERIAL AND ELECTRONIC CIRCUIT PACKAGE

机译：电子电路封装及核心材料和电子电路封装的激光加工中具有低热膨胀系数和低介电常数的核心材料

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PURPOSE: To provide perfluoro carbon composition of a polymer having thermal stability at the temperature at the laser processing and printed-circuit-board manufacturing at 308 nanometers. ;CONSTITUTION: This polymer composition has a main amount of perfluoro carbon composition, which is substantially transparent to ultraviolet rays, and a second polymer such as polyimide, which is thermally stable for imparting ultraviolet-ray processing. This is the manufacturing method for providing a forming method of the polymer composition, a through-hole for the polymer composition and the printed circuit board, including the laser removal of a via.;COPYRIGHT: (C)1994,JPO

机译：用途：提供聚合物的全氟化碳组合物，该聚合物在308纳米的激光加工和印刷电路板制造时的温度下具有热稳定性。 ;组成：该聚合物组合物具有主要量的全氟碳组合物，其对紫外线基本上是透明的，以及第二聚合物，例如聚酰亚胺，其对于施加紫外线处理是热稳定的。这是用于提供聚合物组合物的形成方法，该聚合物组合物的通孔和印刷电路板的制造方法，包括激光去除通孔。; COPYRIGHT：（C）1994，JPO

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公开/公告号JPH0613495A

专利类型
公开/公告日1994-01-21

原文格式PDF
申请/专利权人 INTERNATL BUSINESS MACH CORP IBM;
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申请/专利号JP19910255635
发明设计人 LAWRENCE MARK BROWN;STEVEN LESLIE BOOKWALTER;CHARLES ROBERT DAVIS;RISA JANEEN HIMERLES;MEHTA ASHIT A;EUGENE ROMAN SKALBINKO;
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申请日1991-10-03
分类号H01L23/14;C08L27/12;C08L79/08;H01L23/08;H05K1/03;H05K3/00;
国家 JP
入库时间 2022-08-22 04:52:39

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