Metal-insulator-metal (MIM) capacitor-around-via structure for a monolithic microwave integrated circuit (MMIC) and method of manufacturing same

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  机译： 具有导体支持的共面波导的单片微波集成电路（MMIC）及其设计方法

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  机译： 具有导体支持共面波导的单分子微波集成电路（MMICS）和设计这种MMICS的方法

• 5. MONOLITHIC MICROWAVE INTEGRATED CIRCUITS (MMICs) HAVING CONDUCTOR-BACKED COPLANAR WAVEGUIDES AND METHOD OF DESIGNING SUCH MMICs [P] . 美国专利： US2012327624A1 . 2012-12-27

  机译： 具有导体支持共面波导管的单分子微波集成电路（MMIC）和设计这种MMIC的方法

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