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Brass electrodeposition method at high current density
Brass electrodeposition method at high current density
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机译：高电流密度下的黄铜电沉积方法
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摘要
In the present invention, when brass is electrodeposited on a surface of a metal to be bonded to a resin layer, the brass plating solution is prepared by mixing 70 to 90 g / l of chromium copper, 120 to 140 g / l of potassium cyanide, 7 to 10 g / l of zinc oxide, 5 to 20 ml / l of mono or triethanolamine, 10 g / l of sodium tartarate, and a metal at a plating solution temperature of 30-60C and a current density of 30-40 A / dm2, A treatment time of 1 to 2 seconds, and a plating solution circulation rate of 0.6 to 1.0 m / sec. According to the present invention, a brass electrodeposition material excellent in heat resistance and chemical resistance at a high oil-. /RTI
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机译：在本发明中，当将黄铜电沉积在要与树脂层结合的金属表面上时，通过将70至90 g / l的铬铜，120至140 g / l的氰化钾混合来制备黄铜镀液。 ，7至10克/升的氧化锌，5至20毫升/升的单乙醇酸或三乙醇胺，10克/升的酒石酸钠和一种金属，电镀液温度为30-60C，电流密度为30-40 A / dm 2 ，处理时间为1到2秒，镀液循环速度为0.6到1.0 m / sec。根据本发明，在高油中耐热性和耐化学药品性优异的黄铜电沉积材料。
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