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High value tantalum capacitors using organic semiconducting cathodes - uses tantalum foil with powdered tantalum sintered to its surface

机译:使用有机半导体阴极的高价值钽电容器-使用钽粉,钽粉烧结在其表面

摘要

The Ta-capacitors with semiconducting cathode feature a Ta-foil or sheet which has on one or both surfaces Ta powder attached by sintering and an organic semiconducting cathode. The Ta-powder layer is pref. 0.01-0.5mm thick, esp. 50-100 micron. The carrier is pref. etched Ta-foil or sheet. The organic semiconductors used as cathode are pref. a TCNQ-complex, polyethylene, polypyrrole, polyaniline or polythiophene. The foil or sheet can be folded or spiralled and the cathode material is applied after the final shape has been achieved. Contacts can be made by including an Al-foil in the windings. USE/ADVANTAGE - The use of the modified foil or sheet results in a large are Ta-electrode which has a reduced penetration depth compared with a current sintered powder electrode. This allows easier penetration by the cathode material. The resulting electrode area is much larger than can be achieved using etched foils.
机译:具有半导体阴极的Ta电容器的特征在于:Ta箔或片,其在一个或两个表面上具有通过烧结附接的Ta粉和有机半导体阴极。 Ta粉层是优选的。 0.01-0.5mm厚,特别是50-100微米。承运人是首选。蚀刻的铝箔或薄片。用作阴极的有机半导体是优选的。 TCNQ络合物,聚乙烯,聚吡咯,聚苯胺或聚噻吩。箔或片可以折叠或成螺旋形,并在达到最终形状后施加阴极材料。可以通过在绕组中包含铝箔来进行接触。使用/优点-改性箔或片的使用导致Ta电极大,与目前的烧结粉末电极相比,Ta电极的穿透深度减小。这使得阴极材料更容易渗透。所得的电极面积比使用蚀刻箔所能达到的大得多。

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