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METHOD OF INTRODUCING IMPURITIES TO SEMICONDUCTOR FILM INCLUDING HYDROGEN

机译:在包含氢的半导体膜中引入杂质的方法

摘要

PURPOSE:To diffuse an impurity efficiently by executing heat treatment at a high temperature for removing hydrogen to a semiconductor film containing hydrogen. CONSTITUTION:When a semiconductor film such as a polycrystalline silicon film 7 is formed normally onto a substrate 1 through a CVD method, a large quantity of hydrogen are included in the polycrystalline silicon film 7 because the hydride of silicon and a gas containing hydrogen are used as a raw material gas. The hydrogen contained is volatilized and removed from the surface of the polycrystalline silicon film 7 through heat treatment at a temperature higher than the forming temperature of the polycrystalline silicon film 7 such as 600 deg.C or more. Consequently, when a silicon oxide film 8 to which an impurity is added is shaped onto the polycrystalline silicon film 7 and the impurity is diffused to the polycrystalline silicon film 7, hydrogen from the polycrystalline silicon film 7 is not bonded with the impurity in the silicon oxide film 8. Accordingly, the impurity is diffused efficiently.
机译:目的:通过在高温下执行热处理以将氢去除到含氢的半导体膜中,有效地扩散杂质。组成:当通过CVD方法在衬底1上正常形成诸如多晶硅膜7之类的半导体膜时,由于使用了硅的氢化物和含氢气体,多晶硅膜7中会包含大量氢作为原料气。通过在比多晶硅膜7的形成温度高的温度例如600℃以上的温度下进行热处理,使所含的氢挥发并从多晶硅膜7的表面除去。因此,当将添加有杂质的氧化硅膜8成形到多晶硅膜7上并且杂质扩散到多晶硅膜7上时,来自多晶硅膜7的氢不会与硅中的杂质结合。因此,杂质有效地扩散。

著录项

  • 公开/公告号JPH02205353A

    专利类型

  • 公开/公告日1990-08-15

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP19890025155

  • 发明设计人 TSUNASHIMA YOSHITAKA;

    申请日1989-02-03

  • 分类号H01L27/04;H01L21/316;H01L21/822;

  • 国家 JP

  • 入库时间 2022-08-22 06:25:21

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